PANews reports that Bank of America, Blackstone, Citigroup and Morgan Stanley will establish a financing structure for Anthropic’s use of Broadcom AI computing equipment 63000000000 USD financing structure, with delivery of the relevant equipment expected to begin in 2027 year.
AI Chip-backed financing may expand, with Broadcom, SpaceX, and others reportedly planning large-scale financing; some CoreWeave bonds have fallen to par 80%, with yields rising to around 15%。
Anthropic Reportly is offering Blackstone a yield of more than 10%to raise 60000000000 USD in chip financing to purchase approximately 1.5 gigawatts of Google-customized TPU. The transaction could set a record for chip financing.
