bibibi.ccLoading…
Connect scattered updates into a story you can understand.
PANews reports that Bank of America, Blackstone, Citigroup and Morgan Stanley will establish a financing structure for Anthropic’s use of Broadcom AI computing equipment 63000000000 USD financing structure, with delivery of the relevant equipment expected to begin in 2027 year.
AI Chip-backed financing may expand, with Broadcom, SpaceX, and others reportedly planning large-scale financing; some CoreWeave bonds have fallen to par 80%, with yields rising to around 15%。
Anthropic Reportly is offering Blackstone a yield of more than 10%to raise 60000000000 USD in chip financing to purchase approximately 1.5 gigawatts of Google-customized TPU. The transaction could set a record for chip financing.
CoreWeave is seeking to bring in insurance capital to reduce the financing costs of AI chip purchases and infrastructure construction. This year, the company has raised more than 35000000000 USD, with debt and lease obligations of approximately 52000000000 USD。