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TSMC's CEO C.C. Wei stated that, if it participates in Musk's Terafab project, the wafer fab must be operated by TSMC; the two sides have not disclosed specific cooperation terms.
PANews reported that, in a discussion of memory-chip competition on X, Musk said China has strong capacity-expansion capabilities after mastering manufacturing, and believes HBM and other advanced memory technologies are more difficult to overcome.
Musk said his companies may find a chip manufacturing method superior to those of their peers based on their experience manufacturing custom equipment, but it is currently unclear how this would be achieved or how long it would take.
PANews cited Wccftech as reporting that Musk proposed that Terafab could produce 1 of AI computing power; multiple industry insiders believe that achieving a stable mass-production yield target will be extremely difficult.
Citing Korean media, BlockBeats reported that ASML has notified Samsung Electronics and SK SK hynix that, in the South Korean market,EUV、DUV prices for lithography machine components will be raised 10%, with the changes expected to take effect next year January.
Intel CEO Lip-Bu Tan said that the company will continue participating in Musk’s Terafab project. Musk’s previous discussions with TSMC about a potential partnership had raised concerns that Intel’s role could be affected.
Market news says TSMC is considering building a park worth tens of billions USD in Texas, United States, to produce more artificial intelligence chips.
According to business sources, Jensen Huang plans to meet in New York on September 28 with Samsung Electronics' Lee Jae-yong and SK SK Group's Choi Tae-won. The agenda may include cooperation on high-bandwidth memory, foundry services, and advanced packaging.
Musk reportedly said in a CCTV Finance interview that China’s AI models perform near the global forefront per unit of computing power, and predicted that China could close the computing power gap through lithography and chip manufacturing within two to 3 years.