Jensen Huang is reportedly planning to meet Lee Jae-yong and Choi Tae-won in New York, possibly to discuss cooperation on HBM and other areas.
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AT A GLANCE
Jensen Huang is reportedly scheduled to meet Lee Jae-yong and Choi Tae-won in New York on September 28.
Article
【Huang Renxun 28 to Meet Lee Jae-yong and Choi Tae-won in New York】
NVIDIA CEO Jensen Huang will, local time,September 28 meet Samsung Electronics Executive Chairman Lee Jae-yong again in New York,SK SK Group Chairman Choi Tae-won, about three July months after the three met 2 months ago in San Francisco. According to 27 business sources, Lee Jae-yong and Choi Tae-won plan to attend the Korea Society's annual dinner in New York that evening at 6 o'clock. Jensen Huang will attend as this year's Van Fleet Award recipient, while Samsung Electronics is advancing related cooperation with NVIDIA. Issues of industry interest include high-bandwidth memory. Sources said that Jun Young-hyun, vice chairman of Samsung Electronics' Device Solutions Division, met with Huang during his visit to South Korea, and the two sides discussed June long-term cooperation on next-generation high-bandwidth memory such as HBM4E、HBM5 The New York meeting may also cover foundry services and advanced packaging, and June next-generation foundry cooperation was also discussed during the talks.
Key points
01
NVIDIA CEO Jensen Huang plans to meet Samsung Electronics Executive Chairman Lee Jae-yong in New York at local time September 28 and SK SK Group Chairman Choi Tae-won.
02
The three previously met July in San Francisco.
03
Lee Jae-yong and Choi Tae-won plan to attend the Korea Society's annual dinner in New York, and Jensen Huang will attend as the Van Fleet Award recipient.
04
Related topics may include high-bandwidth memory, foundry services, and advanced packaging.
05
Samsung Electronics is advancing related cooperation with NVIDIA.
AI-assisted interpretation
The following is analysis, separate from reported facts. Verify important claims independently.
This is a news report about the planned meeting of three corporate leaders in New York. The report says they may discuss cooperation on memory, chip manufacturing, and packaging, but does not yet specify any concrete agreement.
Why it matters to readers
If the meeting takes place and cooperation advances, it could affect expectations for supply-chain coordination between NVIDIA, Samsung Electronics, and other companies.
High-bandwidth memory is used to support high-performance computing; foundry services involve manufacturing chips on behalf of others; advanced packaging is an integration process performed after chip manufacturing.
Risks and unknowns
The information comes from business sources, and whether the three parties will actually meet has not yet been confirmed by an official announcement in the evidence.
The evidence does not confirm whether the meeting resulted in any specific cooperation.
The evidence does not indicate whether the relevant issues were ultimately included in the talks.
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Related concepts
high-bandwidth memory
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