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Connect scattered updates into a story you can understand.
According to reports, TSMC is considering raising prices for AI packaging used for high-end CoWoS chips 10%to 20%, although the plan has not yet been implemented. If the price increase is implemented, costs for customers such as NVIDIA and AMD may rise.
Reports said that TSMC's preliminary third-quarter revenue was approximately 1490000000000 New Taiwan dollars, setting a record;LSEG LSEG's analyst consensus estimates that its net profit will increase year on year by 65%to 746300000000 New Taiwan dollars. The formal report is scheduled for October 15 release.
partly owned by TSMC VIS and NXP's joint-venture wafer fab holds an inauguration ceremony in Singapore;VIS says capacity is sold out, plans to begin mass production in early 2027.
Chip expert Mr. Bubble said that constraints on AI infrastructure are shifting from single-chip computing power to advanced packaging, interconnect latency, and tiered memory, and expressed optimism about flash offloading and 3D DRAM.