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BlockBeats, citing TheElec, reported that Samsung Electronics plans to exit 2030 before 8-inch wafer foundry operations and shift to higher-margin 12-inch advanced process nodes, and plans to close the 2026 plant in the second half of S7.
According to reports, TSMC plans, in the 2028 process targeted for mass production in A14, to reduce the high-density 6T SRAM cell area to 0.017 square micrometers or less and is expected to announce the research results at the end of the year.
Citing supply-chain sources, BlockBeats reported that TSMC plans to raise wafer prices by process node starting in January 2027, with advanced processes potentially seeing larger increases. The report also said that some capacity is tight and that order visibility has extended.