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TSMC A14 process will SRAM shrink the cell area to 0.017 square micrometers or less, restarting scaling after 8 years

According to BlockBeats,October 26, TSMC plans to reduce the high-density 2028 process, targeted for mass production in A14, 6T SRAM(static random-access memory) bit-cell area to 0.017 square micrometers or less, breaking the long-standing stagnation at approximately 2020 since the N5 process, where it has remained at approximately 0.021 square micrometers.

The report said TSMC is expected to announce the relevant research results at the end of the year. Based on currently disclosed data, the A14 process's SRAM cell area is expected to lead Intel's 18A process; the latter previously disclosed a high-density SRAM cell area of 0.021 square micrometers. As Samsung has not yet disclosed the specific SRAM cell size of its latest process, direct comparison is temporarily difficult.SRAM is CPU、GPU and AI key storage components used for high-speed cache inside accelerator chips. Reducing cell area allows more cache to fit within the same chip area, helping alleviate the data-access bottleneck of AI chips and improve performance and energy efficiency.

TSMC said the A14 process, compared with the N2 process, targets a performance increase of 10%to 15%, a power-consumption reduction of 25%to 30%, and an approximately 20%increase in chip density. The process is currently advancing toward the mass-production target for 2028, but final yield, cost, and customer adoption remain to be confirmed.

Original link https://m.theblockbeats.info/flash/373739